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Microelectronics Engineer - Entry to Experienced Level (Maryland)

National Security Agency (NSA) | Fort Meade MD 20755 USA | Part Time | Posted: 05/07/2024

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ResponsibilitiesWith the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission. Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission. The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer. 1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: - Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design - Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL - Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis - Understanding and development of assembly specifications in accordance with industry standards - Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design - Conduct research including studies, experiments, and investigations on new or alternate methodologies - Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: - Participate in assembly and fabrication process improvement efforts - Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment - Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 3. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include: - Conduct environmental and reliability tests - High-pin-count Integrated Circuit (IC) design and operation validation - Parametric testing - Accelerated testing / qualification / screening - Develop test plans according to industry and military specifications - Design and develop test platforms - Support quality assurance efforts for developed and fielded systems - Disassembly and sample preparation for physical analysis of ICs for failure analysis - Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)
noreply@intelligencecareers.gov. For job vacancies that include stated testing requirements, also include the following: @uwe.nsa.gov, @nsa.gov, and @pearson.com** U.S. Citizenship is required for all applicants. NSA is an equal opportunity employer and abides by applicable employment laws and regulations. All applicants and employees are subject to random drug testing in accordance with Executive Order 12564. Employment is contingent upon successful completion of a security background investigation and polygraph. Reasonable accommodations may be provided to applicants with disabilities during the application and hiring process where appropriate. Please visit our Diversity link for more information https://www.intelligencecareers.gov/NSA/diversity-and-inclusion.

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Location Fort Meade, MD, 20755, United States
Categories Engineering

Location Maptop

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Job Code 1229522

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